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Arcom is a Gold level partner in the Microsoft
Windows Embedded Partner program and is committed to
the support of Windows CE and Windows XP embedded technologies to achieve rapid development for customer
applications. This was formally recognized at this years
Microsoft Windows Embedded Partner Summit when Arcom was
awarded ‘Independent Hardware
Vendor of the Year, 2002’ for its innovation and
expertise in the embedded market.
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The
Gold level partner status was established to enable
customers to identify best-in-class companies who have
demonstrated excellence
in
building and enabling Windows Powered solutions.
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Arcom
has demonstrated this capability since introducing the concept of
ready-to-run Development Kits for CE 2.xx, 3.0, 4.x (.NET) and now
CE 5.0. These hardware/software Development Kits bundle all the
components needed to start immediate development including a fully
configured single board computer, power supply, cables,
comprehensive CD and operating system license as well eMbedded
Visual Tools C++ 4.0. The product range also includes similar
Development Kits for XP Embedded.
These Development Kits let customers
quickly experiment, demonstrate and deploy Windows powered
solutions using Arcom’s embedded processor boards without the
need to use Platform Builder.
If
however, you need to optimize the operating system image, Arcom
can offer the technical expertise of our dedicated Windows
Embedded Development team to work with you, either
to enhance the features of the operating system or reduce the
footprint to save storage space. Arcom has a track record of helping a wide range of industrial and OEM
customers to develop and integrate new drivers and achieve the
very best from the underlying operating system.
Arcom
offers Windows CE Development Kits for the 400MHz Intel
XScale VIPER
board, 300MHz Geode GX1 SBC-GX1,
133MHz AMD SC520 PEGASUS
PC/104 board and also the Intel Celeron/Pentium III Socket 370 OLYMPUS
board. As a Gold level partner,
Arcom has a continuous program of development for both Windows CE and XP Embedded.
Arcom’s
great strength is being able to combine the technical expertise of
the hardware designs with the detailed understanding of the
operating system features. Arcom is actively involved in the BSP
(board support package) Technical events hosted by Microsoft
several times each year. This ensures we gain maximum insight into
emerging Windows CE .NET technologies and lets our Windows
Embedded Teams
in Kansas City and Cambridge
England provide the
best-in-class Design Service capabilities expected from Gold level
partners.
Arcom
is also pleased to be associated with the Hardware
Empowerment Program (HEP) for Windows Embedded, an initiative
to support research and experimentation in embedded systems. This
program is specifically aimed at key research institutions around
the world who are actively involved in research and development
for embedded systems.
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